GLZ9.1C Features
* Planar Die construction
* 500mW Power Dissipation
* Ideally Suited for Automated Assembly Processes
* Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA
* Case: Molded Glass MINI-MELF
* Terminals: Solderable per MIL-STD-750, M
Datasheet Details
GLZ9.1C, GLZ2.0A
PAN JIT
166.20 KB
Surface mount zener diodes.
This datasheet PDF includes multiple part numbers: GLZ9.1C, GLZ2.0A.
Please refer to the document for exact specifications by model.
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GLZ9.1C Distributor
