P6SMB
FEATURES
- For surface mounted applications in order to optimize board space.
- Low profile package
- Built-in strain relief
- Glass passivated junction
- Low inductance
- Typical ID less than 1.0µA above 10V
- Plastic package has Underwriters Laboratory Fammability Classification 94V-O
- High temperature soldering : 260°C /10 seconds at terminals
- In pliance with EU Ro HS 2002/95/EC directives
MECHANICAL DATA
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- Case:JEDEC DO-214AA ,Molded plastic over passivated junction Terminals: Solder plated,solderable per MIL-STD-750,Method 2026 Polarity: Color band denotes positive end (cathode) Standard Packaging:12mm tape (EIA-481) Weight: 0.003 ounce, 0.093 gram
DEVICES FOR BIPOLAR APPLICATIONS
For Bidirectional use C or CA Suffix for types Electrical characteristics apply in both directions.
MAXIMUM RATINGS AND CHARACTERISTICS
Rating at 25°Cambient temperature unless otherwise specified. Resistive or inductive load, 60Hz. For Capacitive load derate current by 20%.
Rating Peak...