BZQ5221B Datasheet (PDF) Download
PanJit Semiconductor
BZQ5221B

Key Features

  • Planar Die construction
  • Ideally Suited for Automated Assembly Processes MECHANICAL DATA
  • Case: Molded Glass QUADRO-MELF
  • Terminals: Solderable per MIL-STD-202E, Method 208
  • Polarity: See Diagram Below
  • Approx. Weight: 0.03 grams
  • Mounting Position: Any