SBM360VBF Key Features
- Ideal for automated placement
- Ultra low forward voltage drop, low power loss
- High efficiency operation
- Low thermal resistance
- Ultra thin profile package for space constrained utilization
- Easy pick and place package suitable for automated handling
- Lead free in pliance with EU RoHS 2011/65/EU directive
- Green molding pound as per IEC61249 Std. . (Halogen Free)
- Case: SMBF package
- Terminals: solder plated, solderable per MIL-STD-750,Method 2026