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AN80T05 Datasheet Silicon Monolithic Bipolar IC

Manufacturer: Panasonic

General Description

) Chip surface passivation Lead frame material Inner lead surface process Others ( Others ( Others ( ) ) ) ) 1 2 , 6 2 6 3 4 4 5 5 7 *3 *3 Outer lead surface process Chip mounting method Wire bonding method Wire material Mold material Molding method Fin material Solder plating (98Sn-2Bi), Solder dip, Others ( Ag paste, Au-Si alloy, Solder (95.5Pb-2.5Ag-2Sn)** Others ( Others ( Others ( Others ( Others ( ) ) ) ) ) Thermalsonic bonding, Au, Epoxy, Transfer

Overview

Panasonic Semiconductor Singapore Company Registration No.

197803125E 22, Ang Mo Kio Industrial Park 2, Singapore 569506.

Tel: (65)64818811 Fax: (65)64816486 A Division of Panasonic Semiconductor Asia Pte Ltd DOCUMENT COVER PAGE Issue Level 1 Rev 4 Eff Date 21-MAR-05 Note: This cover page establishes the Doc No., Title and current status of the attached document.