ELJRF1N2FB
Features
High frequency capability due to its non magnetic core. Capable of being Re-flow or flow soldered. Unique Ceramic Core/Laser-cut Technology. Non polarity product. Good for mounting. Ro HS pliant
- Remended Applications
RF circuitry for cellular phones and wireless munication equipment.
- Explanation of Part Numbers
1 2 3 4 5 6 7 8 9 10 11
&-+3' /+'#
Packaging Design No.
Product code Chip Inductors
Shape RF 1005 (0402) RE 1608 (0603) Size : mm (inch)
Inductance 1N5 1.5 n H 10N 10 n H R22 220 n H
Inductance tolerance Z ±0.2 n H D ±0.3 n H G ±2 % J ±5 %
F Taping
Storage Conditions
Package
: Normal temperature (- 5 to 35 °C), normal humidity (85 %RH max.), shall not be exposed to direct sunlight and harmful gases and care should be taken so as not to cause dew.
Operating Temperature :
- 40 to +85 °C
Storage Period Solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation of tin-plated terminals. Even if storage...
