* Power Mount CSP Packaging (PMCP) that is comprised of a unique pad design and drain clip technology. This allows for a 5% improvement in thermal dissipation while simultaneously reducing the size by 80% over the conventional solutions. Panasonic’s advances in cell technology and wafer thinning fabr
FJ3P02100L Datasheet (271.36 KB)
FJ3P02100L
Panasonic Battery
271.36 KB
Power csp mosfet.
New Product Introduction NEW! FJ3P02100L & FK3P02110L Series Power CSP MOSFET’s With Panasonic’s Advanced 110nm Fine Trench Cell Silicon Technology P.
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