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EZANP - Chip Capacitor Networks

Key Features

  • s.
  • Chip Capacitor Networks, exclusively developed by Panasonic using thick film technology. 8 capacitors bussed in one package (6.4 mm ҂ 3.1 mm ҂ 0.75 mm, 1.27 mm pitch), halfpitch (0.635 mm) spacing for high density automatic placing.
  • Excellent noise reduction by connecting both ground terminals and a simple layout pattern (less through hole).
  • Excellent mountability using concave terminals, firm solder joint (2 times that of convex terminal), self-aligning placement during reflow s.

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Datasheet Details

Part number EZANP
Manufacturer Panasonic
File Size 145.63 KB
Description Chip Capacitor Networks
Datasheet download datasheet EZANP Datasheet

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Chip Capacitor Networks www.DataSheet4U.com Chip Capacitor Networks Type: EZANP GND GND ■ Features ● Chip Capacitor Networks, exclusively developed by Panasonic using thick film technology. 8 capacitors bussed in one package (6.4 mm ҂ 3.1 mm ҂ 0.75 mm, 1.27 mm pitch), halfpitch (0.635 mm) spacing for high density automatic placing ● Excellent noise reduction by connecting both ground terminals and a simple layout pattern (less through hole) ● Excellent mountability using concave terminals, firm solder joint (2 times that of convex terminal), self-aligning placement during reflow soldering I/O I/O I/O No Through Hole 0.