acteristics (Continued) TC = 25°C ± 3°C
Parameter Total gate charge Gate-source charge Gate-drain charge Channel-case heat resistance Channel-atmosphere heat resistance Symbol Qg Qgs Qgd Rth(ch-c) Rth(ch-a) VGS = 10 V Conditions VDD = 100 V, ID = 25 A Min Typ 85 30 12 1.25 41.6 Max Unit nC nC nC °C/W °C/W
Note) Measuring methods are based on.
Power MOSFETs
2SK3637
Silicon N-channel power MOSFET
15.5±0.5
Unit: mm
φ 3.2±0.1 5˚ 3.0±0.3 5˚
For PDP/For high-speed switching
(10.0) 26.5±0.5
(4.5)
• Low on-resistance, low Qg • High avalanche resistance
(2.0)
5˚ (4.0) 2.0±0.2 1.1±0.1 0.7±0.1 5.45±0.3 10.9±0.5 5˚ 5˚
■ Absolute Maximum Ratings TC = 25°C
Parameter www.DataSheet4U.com Drain-source surrender voltage Gate-source surrender voltage Drain current Peak drain current Avalanche energy capability * Power dissipation Ta = 25°C Tch Tstg Symbol VDSS VGSS ID IDP EAS PD Rating 200 ±30 50 200 2 000 100 3 150 −55 to +150 °C °C Unit V
3.3±0.3
A A mJ W
5˚
1
2
3
5.5±0.3
V
18.6±0.5 (2.0) Solder Dip
1: Gate 2: Drain 3: Source TOP-3E-A1 Package
Internal Connection
Channel temperature Storage temperature
(2.