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Philips Semiconductors Advanced BiCMOS Products
Application note
Thermal considerations for advanced logic families (Futurebus+, ABT and MULTIBYTE)
AN241
INTRODUCTION
Thermal characteristics of integrated circuit packages have been and increasingly will be a major consideration to both producers and users of electronics products. This is because an increase in junction temperature (TJ) can adversely effect the long term operating life of an IC. The advantages realized by miniaturization often have trade–offs in terms of increased junction temperatures. Some of the variables affecting TJ are controlled by the IC manufacturer and others are controlled by the system designer.
AN241 Datasheet
