GLZ56 Features
* Planar Die construction
* 500mW Power Dissipation
* Ideally Suited for Automated Assembly Processes
* In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA
* Case: Molded Glass MINI-MELF
* Terminals: Solderable per MIL-STD-750, Method 2026
Datasheet Details
GLZ56, GLZ2.0A
Rectron
95.86 KB
Surface mount zener diodes.
This datasheet PDF includes multiple part numbers: GLZ56, GLZ2.0A.
Please refer to the document for exact specifications by model.
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