Description
Assembly Die Process ANALYSIS RESULTS I Assembly ANALYSIS RESULTS II Die Process and Design ANALYSIS PROCEDURE TABLES Overall Evaluation Package Markings Wirebond Strength Die Material Analysis Horizontal Dimensions Vertical Dimensions
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INTRODUCTION This report describes a competitive analysis of the Rockwell 11577-11 digital correlator.One device packaged in a 144-pin Square Quad Flat Package (SQFP) was received for the ana
Features
- Titanium silicided diffusion structures. 1These items present possible quality or reliability concerns. They should be discussed with the manufacturer to determine their possible impact on the intended.
11577-11_Rockwell.pdf
