MBR1060CT
Features
:
- 150 °C TJ operation
- Center tap configuration
- Low forward voltage drop
- High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
- High frequency operation
- Guard ring for enhanced ruggedness and long term reliability
- This is a Pb
- Free Device
- All SMC parts are traceable to the wafer lot
- Additional testing can be offered upon request
Case styles MBRB1060CT
MBR1060CT-1
TO-220AB
D2PAK
Mechanical Dimensions: In Inches / mm
TO-262
TO-220AB
- Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907
- - FAX (86) 25-87123900
- World Wide Web Site
- http://.sangdest..cn
- E-Mail Address
- sales@ sangdest..cn
- SANGDEST MICROELECTRONICS
Technical Data Data Sheet N0031, Rev.
- D2PAK
MBR1060CT MBRB1060CT MBR1060CT-1
Green Products
Symbol
A A1 A2 b b1 c c1 D D1 E E1 E2 e H L L1 L2 L3 e e1 e2 e3
Dimensions in millimeters
Min. Typical...
