SBRD5150 SANGDEST MICROELECTRONICS Datasheet

SBRD5150 Key Features

• 175 °C TJ operation
• Center tap configuration
• Low forward voltage drop
• High purity, high temperature epoxy encapsulation for enhanced mechanical strength and
• High frequency operation
• Guard ring for enhanced ruggedness and long term reliability
• This is a Pb
• Free Device
• All SMC parts are traceable to the wafer lot
• Additional testing can be offered upon request