SEP ELECTRONIC CORP.
KBP005M thru KBP10M
1.5 A Single-Phase Silicon Bridge Rectifier
Rectifier Reverse Voltage 50 to 1000V
14.7+ 0.5
Features
This series is UL listed under the Recognized
Component Index, file number E142814
Ideal for printed circuit board mounting
The plastic material used carries Underwriters Laboratory
flammability recognition 94V-0
Built-in printed circuit board stand-offs
High case dielectric strength
High temperature soldering guaranteed 265
seconds at 5 lbs (2.3kg) tension
/10
Mechanical Data
Case: Reliable low cost construction utilizing
molded plastic technique
Terminals: Plated leads solderable per MIL-STD-202,
Method 208
Mounting Position: Any
Weight: 0.065 ounce, 2.2 grams (approx)
12.2+ 0.5
15.2 MIN.
12.7 MIN.
2.41+ 0.25
3.85+0.25
0.81+ 0.05
1.5 + 0.2
4.83+ 0.25
Dimensions in millimeters(1mm =0.0394
Maximum Ratings & Thermal Characteristics
Rating at 25 C ambient temperature unless otherwise specified, Resistive or Inductive load, 60 Hz.
For Capacitive load derate current by 20%.
Parameter
Symbol
KBP
005M
KBP
01M
KBP
02M
KBP
04M
KBP
06M
KBP
08M
Maximum repetitive peak reverse voltage
VRRM 50
100 200 400 600 800
Maximum RMS bridge input voltage
VRMS 35
70 140 280 420 560
Maximum DC blocking voltage
VDC 50
100 200 400 600 800
Maximum average forward rectified
output current at TA=50 C
IF(AV)
1.5
Peak forward surge current single sine-wave
superimposed on rated load (JEDEC Method)
IFSM
Rating for fusing ( t<8.3ms)
I2t
50
15.0
Typical thermal resistance per element (1) ReJA
10.0
Typical junction capacitance per element (2) Cj
25.0
Operating junction and storage temperature TJ,
range
TSTG
-55 to + 150
KBP
10M
unit
1000 V
700 V
1000 V
A
A
A2sec
C/W
pF
Electrical Characteristics
Rating at 25 C ambient temperature unless otherwise specified. Resistive or Inductive load, 60Hz.
For Capacitive load derate by 20 %.
Parameter
Symbol
Maximum instantaneous forward voltage drop
per leg at 1.5A
VF
KBP
005M
KBP
01M
KBP
02M
KBP
04M
1.1
KBP
06M
KBP
08M
Maximum DC reverse current at rated TA =25 C
DC blocking voltage per element TA =125 C
IR
10
500
Notes: (1)Thermal resistance from Junction to Ambemt on P.C.board mounting.
(2)Measured at 2.0MHz and applied reverse voltage of 4.0 volts.
KBP
10M
Unit
V
A
2003 SEP ELECTRONIC CORP.
www.sep.net.cn M099
