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SG Micro

SGM3200 Datasheet Preview

SGM3200 Datasheet

Charge Pump Boost DC/DC Integrated Load Switch

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SGM3200
Charge Pump Boost DC/DC
Integrated Load Switch
GENERAL DESCRIPTION
The SGM3200 is a switched capacitor voltage
converter that delivers a regulated output. No external
inductor is required for operation. SGM3200 also
integrates one 500mA load switch.
The SGM3200 can deliver up to 500mA to the voltage
regulated output. It features very low quiescent current
and high efficiency over a large portion of its load range,
making this device ideal for battery-powered
applications. Furthermore, the combination of few
external components and small package size keeps the
total converter board area to a minimum in
space-restricted applications.
The SGM3200 uses charge pump technique to provide
a regulated output from a varying input supply. The
SGM3200 contains a thermal management circuit to
protect the device under high temperature conditions.
The SGM3200 is available in a Green TDFN-3×3-8L
package and is rated over the -40 to +85
temperature range.
FEATURES
Step-Up Voltage Converter
Input Voltage Range: 2.7V to 5.0V
Micro-Power Consumption: 70µA
Fixed 5.0V ± 3% Output Voltage
VOUT1 Provides Continuous 5.0V/500mA Output
VOUT2 Provides 500mA Current Limit Load
Switch Output
High Frequency 1.7MHz Operation
1.8V Logic-Controlled Shutdown of Charge Pump
1.8V Logic-Controlled LSEN Pin to Control Load
switch
Short-Circuit and Over-Temperature Protections
Over-Current Protection
Available in a Green TDFN-3×3-8L Package
APPLICATIONS
Cellular Phones
Digital Cameras
LED/Display Backlight Driver
LEDs for Camera Flash
TYPICAL APPLICATION
CFLY
1.0μF
VBAT
4.7μF
EMI Bead
2.2μF
Enable
Enable
1
6 VIN CP
2
CN
VOUT1 8
SGM3200
5 nSHDN
4 LSEN
GND
7
VOUT2
3
VOUT1 = 5.0V
COUT1
10μF
COUT2
1μF
SG Micro Corp
www.sg-micro.com
DECEMBER 2013 – REV. A




SG Micro

SGM3200 Datasheet Preview

SGM3200 Datasheet

Charge Pump Boost DC/DC Integrated Load Switch

No Preview Available !

SGM3200
Charge Pump Boost DC/DC
Integrated Load Switch
PACKAGE/ORDERING INFORMATION
MODEL
PACKAGE
DESCRIPTION
SPECIFIED
TEMPERATURE
RANGE
ORDERING
NUMBER
SGM3200
TDFN-3×3-8L
-40to +85SGM3200YTDB8G/TR
PACKAGE
MARKING
SGM
MADB
XXXXX
PACKING
OPTION
Tape and Reel, 3000
MARKING INFORMATION
NOTE: XXXXX = Date Code and Vendor Code.
XXXXX
Vendor Code
Date Code - Week
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
VIN to GND ........................................................... -0.3V to 6V
VOUT1 to GND ....................................................... -0.3V to 6V
VOUT2 to GND ........................................-0.3V to VOUT1 + 0.3V
CP to GND........................................................... -0.3V to 6V
CN to GND.................................................0.3V to VIN + 0.3V
nSHDN, LSEN to GND ........................................ -0.3V to 6V
Operating Temperature Range ....................... -40to +85
Junction Temperature.................................................+150
Storage Temperature Range ....................... -65to +150
Lead Temperature (Soldering, 10s) ............................+260
ESD Susceptibility
HBM............................................................................. 2000V
MM................................................................................. 200V
OVERSTRESS CAUTION
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged by ESD if you don’t
pay attention to ESD protection. SGMICRO recommends that
all integrated circuits be handled with appropriate precautions.
Failure to observe proper handling and installation procedures
can cause damage. ESD damage can range from subtle
performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage
because very small parametric changes could cause the
device not to meet its published specifications.
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
DECEMBER 2013
2



Part Number SGM3200
Description Charge Pump Boost DC/DC Integrated Load Switch
Maker SG Micro
Total Page 3 Pages
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