US1DF Key Features
- 低的反向漏电流 Low reverse leakage
- 玻璃钝化芯片 Glass passivated chip junction
- 较强的正向浪涌承受能力 High forward surge capability -快速开关高频应用 Fast switching for high efficiency -高温焊接保证 260°C/10秒 High temperatur
- 引线和管体皆符合 RoHS 标准。Lead and body according
- 封装: 塑料封装 Case: Molded plastic body -端子: 焊料被镀 Terminals: Solder plated -极性: 色环端为负极 Polarity: Color band denotes cathode e
