S71GL128NB0
S71GL128NB0 is (S71GLxxxNB0) Stacked Multi-chip Product (MCP) manufactured by SPANSION.
Features
- Power supply voltage of 2.7 to 3.1V
High Performance
- -
- - 90 ns access time (S71GL128N, S71GL256N) 100 ns access time (S71GL512N) 25 ns page read times Packages:
- 9.0 x 12.0 mm x 1.2 mm FBGA (TLD084) (S71GL512N)
- 8.0 x 11.6 mm x 1.2 mm FBGA (TLA084) (S71GL128N, S71GL256N)
- Operating Temperature
- -25°C to +85°C (Wireless)
- -40°C to +85°C (Industrial)
General Description
The S71GL Series is a product line of stacked Multi-chip Product (MCP) packages and consists of
- One Flash memory die
- one p SRAM
The products covered by this document are listed in the table below. For details about their specifications, please refer to the individual constituent datasheets for further details. Flash Memory Density 512 Mb 128 Mb p SRAM Density 64 Mb 32 Mb 16 Mb S71GL512NB0 S71GL256NB0 S71GL128NB0 256 Mb 128 Mb
Publication Number S71GL512_256_128NB0_00
Revision A
Amendment 1
Issue Date December 7, 2004
This document contains information on a product under development at Spansion LLC. The information is intended to help you evaluate this product. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.
A d v a n c e
I n f o r m a t i o n
S71GL512NB0/S71GL256NB0/S71GL128NB0
General Description
- -
- - . . . . 1 Product Selector Guide
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- - . 4
MCP Block Diagram (128Mb Flash + 32Mb p SRAM) 5 MCP Block Diagram (256Mb Flash + 32Mb p SRAM) 5 MCP Block Diagram (512Mb Flash + 32Mb p SRAM) 6
Logical Inhibit 45 Power-Up Write Inhibit 45 mon Flash Memory Interface (CFI)
- . . 45
Table 6. CFI Query Identification String Table 7. System...