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S75WS256N - Stacked Multi-Chip Product

Download the S75WS256N datasheet PDF. This datasheet also covers the S75WS-N variant, as both devices belong to the same stacked multi-chip product family and are provided as variant models within a single manufacturer datasheet.

Description

of Spansion data sheet designations are presented here to highlight their presence and definitions.

The Advance Information designation indicates that Spansion LLC is developing one or more specific products, but has not committed any design to production.

Features

  • Power supply voltage of 1.7 V to 1.95 V.
  • High Performance.
  • 54 MHz, 66 Mhz, 80 MHz.
  • Packages.
  • 9 x 12 mm 84 ball FBGA.
  • 11 x 13 mm 115 ball FBGA.
  • Operating Temperature.
  • Wireless,.
  • 25°C to +85°C Publication Number S75WS-N_02 Revision A Amendment 2 Issue Date October 6, 2005 P r e l i m i n a r y Contents S75WS-N Based MCPs.
  • i 1 2 3 4 5 Product.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (S75WS-N_SPANSION.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.DataSheet4U.com S75WS-N Based MCPs Stacked Multi-Chip Product (MCP) 256 Megabit (16M x 16-bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory with 128 Mb (8M x 16-Bit) RAM Type 4 and 512 Mb (32M x 16-bit) Data Flash or 1 Gb ORNAND Flash Data Sheet PRELIMINARY Notice to Readers: This document indicates states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of this document indicates that a product qualification has been completed, and that initial production has begun. Due to the phases of the manufacturing process that require maintaining efficiency and quality, this document may be revised by subsequent versions or modifications due to changes in technical specifications.
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