Datasheet4U Logo Datasheet4U.com

QFP-EP Datasheet Exposed Pad Quad Flat Pack

Manufacturer: STATS ChipPAC

📥 Download Datasheet

Datasheet Details

Part number QFP-EP
Manufacturer STATS ChipPAC
File Size 238.22 KB
Description Exposed Pad Quad Flat Pack
Datasheet download datasheet QFP-EP Datasheet

General Description

STATS ChipPAC’s Exposed Pad Quad Flat Pack (QFP-ep) is a thermally enhanced version of the QFP package.

Thermal enhancement is achieved by means of an exposed die pad, which can be soldered to a mother PC board for effective heat removal and grounding.

STATS ChipPAC’s QFP-ep family includes the Exposed Pad-Low Profile QFP (LQFP-ep) and the Exposed Pad-Thin QFP (TQFP-ep).

Overview

www.DataSheet4U.com QFP-ep Exposed Pad Quad Flat Pack • 7 x 7mm to 24 x 24mm body sizes • 32 to 216 lead count • Lead pitch range from 0.80mm to 0.

Key Features

  • Body Sizes: 7 x 7mm to 24 x 24mm.
  • Package Height: 1.0mm (TQFP-ep) and 1.4mm (LQFP-ep).
  • Lead Counts: 32L to 216L.
  • Lead Pitch: 0.40mm to 0.80mm.
  • Wide range of open tool leadframe and die pad sizes available.
  • JEDEC standard compliant.
  • Lead-free and Green material sets available.

📁 Similar Datasheet

Brand Logo Part Number Description Manufacturer
Rohm Logo QFP-A64 LSI Assembly Rohm
Rohm Logo QFP-T80 LSI Assembly Rohm
iSYSTEM QFP44 POD Target Layout iSYSTEM
iSYSTEM QFP44 TET iSYSTEM
Rohm Logo QFP44 LSI Assembly Rohm

More Datasheets from STATS ChipPAC

Part Number Description
QFP-SD Stacked Die Quad Flat Pack