• Part: TSSOP
  • Manufacturer: STATS ChipPAC
  • Size: 119.46 KB
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TSSOP page 2
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TSSOP Key Features

  • Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm
  • Lead Count: 8L to 56L
  • Lead Pitch: 0.50mm & 0.65mm
  • Package Height: 1.20mm max
  • JEDEC standard pliant (MO-153)
  • Lead-free (Pb-free) and Green
  • Thermal Enhancements: ep (exposed pad) MSOP
  • Body Size: 3 x 3mm
  • Lead Count: 8L & 10L
  • Lead Pitch: 0.65mm (8L) and 0.50mm (10L)

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TSSOP Description

STATS ChipPAC offers a plete line of Small Outline Package (SOP) families including TSSOP, TSSOP-ep, and MSOP. STATS ChipPAC’s TSSOP (Thin Shrink Small Outline Package) is suitable for applications requiring a thin profile. TSSOP is a leadframe based, plastic encapsulated package with gull wing shaped leads on two sides with lead count ranging from 8 to 56 leads.