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TSSOP - Small Outline Packages

General Description

STATS ChipPAC offers a complete line of Small Outline Package (SOP) families including TSSOP, TSSOP-ep, and MSOP.

STATS ChipPAC’s TSSOP (Thin Shrink Small Outline Package) is suitable for applications requiring a thin profile.

Key Features

  • TSSOP.
  • Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm.
  • Lead Count: 8L to 56L.
  • Lead Pitch: 0.50mm & 0.65mm.
  • Package Height: 1.20mm max.
  • JEDEC standard compliant (MO-153).
  • Lead-free (Pb-free) and Green.
  • Thermal Enhancements: ep (exposed pad) MSOP.
  • Body Size: 3 x 3mm.
  • Lead Count: 8L & 10L.
  • Lead Pitch: 0.65mm (8L) and 0.50mm (10L).
  • JEDEC standard compliant.
  • Lead-free (Pb-free) and Green.
  • The.

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Datasheet Details

Part number TSSOP
Manufacturer STATS ChipPAC
File Size 119.46 KB
Description Small Outline Packages
Datasheet download datasheet TSSOP Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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TSSOP and MSOP Small Outline Packages • Wide range of body sizes • 8 to 56 lead counts • Thermally enhanced versions available (TSSOP-ep and MSOP-ep) FEATURES TSSOP • Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm • Lead Count: 8L to 56L • Lead Pitch: 0.50mm & 0.65mm • Package Height: 1.20mm max. • JEDEC standard compliant (MO-153) • Lead-free (Pb-free) and Green • Thermal Enhancements: ep (exposed pad) MSOP • Body Size: 3 x 3mm • Lead Count: 8L & 10L • Lead Pitch: 0.65mm (8L) and 0.50mm (10L) • JEDEC standard compliant • Lead-free (Pb-free) and Green • Thermal enhancements: ep (exposed pad) DESCRIPTION STATS ChipPAC offers a complete line of Small Outline Package (SOP) families including TSSOP, TSSOP-ep, and MSOP.