A1P25S12M3-F datasheet, igbt equivalent, STMicroelectronics

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Features and benefits

* ACEPACK™ 1 power module
  – DBC Cu Al2O3 Cu
* Sixpack topology
  – 1200 V, 25 A IGBTs and diodes
  – Soft and fast rec.

Application

* Inverters
* Industrial
* Motor drives Description This power module is a sixpack topology in an ACEPACK™ 1.

Description

This power module is a sixpack topology in an ACEPACK™ 1 package with NTC, integrating the advanced trench gate field-stop technologies from STMicroelectronics. This new IGBT technology represents the best compromise between conduction and switching .

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