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A1P25S12M3-F - IGBT

General Description

This power module is a sixpack topology in an ACEPACK™ 1 package with NTC, integrating the advanced trench gate field-stop technologies from STMicroelectronics.

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A1P25S12M3-F Datasheet ACEPACK™ 1 sixpack topology, 1200 V, 25 A, trench gate field‑stop M series IGBT with soft diode and NTC ACEPACK™ 1 Features • ACEPACK™ 1 power module – DBC Cu Al2O3 Cu • Sixpack topology – 1200 V, 25 A IGBTs and diodes – Soft and fast recovery diode • Integrated NTC Applications • Inverters • Industrial • Motor drives Description This power module is a sixpack topology in an ACEPACK™ 1 package with NTC, integrating the advanced trench gate field-stop technologies from STMicroelectronics. This new IGBT technology represents the best compromise between conduction and switching loss, to maximize the efficiency of any converter system up to 20 kHz.