BALF-NRF01D3 Key Features
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Coated Flip-Chip on Glass
- Small footprint: < 1.5 mm2
- Very low profile: < 560 µm after reflow
- High RF performance
- PCB space saving versus discrete solution
- BOM count reduction
- Efficient manufacturability