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EMIF02-MIC03F2 - EMI filter and ESD protection

Description

The EMIF02-MIC03F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences.

The EMIF02 Flip-Chip packaging means the package size is equal to the die size.

Features

  • EMI symmetrical (I/O) low-pass filter.
  • High efficiency in EMI filtering.
  • Very low PCB space consuming: 1.07 mm x 1.47 mm.
  • Very thin package: 0.65 mm.
  • High efficiency in ESD suppression Datasheet - production data.
  • High reliability offered by monolithic integration.
  • High reducing of parasitic elements through integration and wafer level packaging Complies with the following standards:.
  • IEC 61000-4-2 level 4, on input pins.

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Datasheet preview – EMIF02-MIC03F2

Datasheet Details

Part number EMIF02-MIC03F2
Manufacturer STMicroelectronics
File Size 273.96 KB
Description EMI filter and ESD protection
Datasheet download datasheet EMIF02-MIC03F2 Datasheet
Additional preview pages of the EMIF02-MIC03F2 datasheet.
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Full PDF Text Transcription

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EMIF02-MIC03F2 2-line IPAD™, EMI filter and ESD protection Flip-Chip package Figure 1. Pin configuration (bump side) and basic cell configuration 321 I2 I1 A GND B O2 O1 C Input Low-pass Filter GND GND Output Ri/o = 68 Ω Cline = 100 pF GND Features • EMI symmetrical (I/O) low-pass filter • High efficiency in EMI filtering • Very low PCB space consuming: 1.07 mm x 1.47 mm • Very thin package: 0.
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