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EMIF02-SPK01C2 - EMI filter including ESD protection

Description

The EMIF02-SPK01C2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference.

The Flip-Chip packaging means the package size is equal to the die size.

Features

  • le.
  • EMI symmetrical (I/O) low-pass filter so.
  • High efficiency EMI filter (-33 dB @ 900 MHz) b.
  • Very low PCB space consumption: O 1.07 mm x 1.47 mm ) -.
  • Very thin package: 0.670 mm t(s.
  • Coating resin on back side and lead free c package u.
  • High efficiency in ESD suppression rod.
  • High reliability offered by monolithic integration P.
  • High reduction of parasitic elements through te integration and wafer level packaging. le Compl.

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Datasheet preview – EMIF02-SPK01C2

Datasheet Details

Part number EMIF02-SPK01C2
Manufacturer STMicroelectronics
File Size 215.63 KB
Description EMI filter including ESD protection
Datasheet download datasheet EMIF02-SPK01C2 Datasheet
Additional preview pages of the EMIF02-SPK01C2 datasheet.
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Full PDF Text Transcription

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EMIF02-SPK01C2 2 line IPAD™, EMI filter including ESD protection Datasheet - production data Applications Where EMI filtering in ESD sensitive equipment is ct(s) Coated Flip-Chip package te Produ Features le • EMI symmetrical (I/O) low-pass filter so • High efficiency EMI filter (-33 dB @ 900 MHz) b • Very low PCB space consumption: O 1.07 mm x 1.47 mm ) - • Very thin package: 0.670 mm t(s • Coating resin on back side and lead free c package u • High efficiency in ESD suppression rod • High reliability offered by monolithic integration P • High reduction of parasitic elements through te integration and wafer level packaging.
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