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EMIF06-HMC02F2 - EMI filter

General Description

The EMIF06-HMC02F2 is a highly integrated array designed to suppress EMI / RFI noise for High Speed MultiMediaCard™ port filtering.

The EMIF06-HMC02F2 Flip-Chip packaging means the package size is equal to the die size.

Key Features

  • 6 lines low-pass-filter.
  • High efficiency in EMI filtering.
  • Very low PCB space consuming: < 4 mm².
  • Lead-free package.
  • Very thin package: 0.65 mm.
  • High efficiency in ESD suppression.
  • High reliability offered by monolithic integration.
  • High reducing of parasitic elements through integration and wafer level packaging Complies with the following standards Datasheet - production data.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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EMIF06-HMC02F2 6-line IPAD™, EMI filter including ESD protection )OLS&KLSSDFNDJH EXPSV Features  6 lines low-pass-filter  High efficiency in EMI filtering  Very low PCB space consuming: < 4 mm²  Lead-free package  Very thin package: 0.65 mm  High efficiency in ESD suppression  High reliability offered by monolithic integration  High reducing of parasitic elements through integration and wafer level packaging Complies with the following standards Datasheet - production data Description The EMIF06-HMC02F2 is a highly integrated array designed to suppress EMI / RFI noise for High Speed MultiMediaCard™ port filtering. The EMIF06-HMC02F2 Flip-Chip packaging means the package size is equal to the die size.