EMIF06-HMC02F2 Datasheet | STMicroelectronics

Features - 6 lines low-pass-filter - High efficiency in EMI filtering - Very low PCB space consuming: < 4 mm² - Lead-free package - Very thin package: 0.65 mm - High efficiency in ESD suppression - High reliability offered by monolithic integration - High reducing of parasitic elements through integration and wafer level packaging plies with the following standards - production data Description The EMIF06-HMC02F2 is a highly integrated array designed to suppress EMI / RFI noise for High Speed Multi Media Card™ port filtering. The EMIF06-HMC02F2 Flip-Chip packaging means the package size is equal to the die size. Additionally, this filter includes an ESD protection circuitry which prevents the protected device from destruction when subjected to ESD surges up to 15 k V. pared to EMIF06-HMC01F2, the EMIF06-HMC02F2 has its ground balls connected together internally. Figure 1. Pin configuration (ball side) $ % & ' Figure 2. Basic cell configuration 5 5 5 5 5 9PPF 00&FO N 00&FP G 00&GDW 00&GDW 00&GDW 00&GDW 9PPF 5 FO N 5 FP G 5 GDW 5 GDW 5 GDW 5 GDW - IEC 61000-4-2 level 4 on external pins - 15 k V (air discharge) - 8 k V (contact discharge) - MIL STD 883E - Method 3015-6 Class 3 Applications - High Speed Multi Media Card™ -...