Datasheet4U Logo Datasheet4U.com

ESDA14V2-4BF3 - Quad bidirectional TRANSIL array

Description

The ESDA14V2-4BF3 is a monolithic array designed to protect up to 4 lines in a bidirectional way against ESD transients.The device is ideal for situations where board space saving is requested.

This device is particularly adapted to the protection of symmetrical signals.

Features

  • 4 Bidirectional Transil functions ESD Protection: IEC61000-4-2 level 4 Stand off voltage: 12 V Min. Low leakage current < 0.5 µA 50 W Peak pulse power (8/20 µs) Flip Chip (5 bumps) Benefits.
  • High ESD protection level High integrationSuitable for high density boards Suitable for high density boards Figure 1. Pin layout (bump side) 3 2 1 A B C Complies with the following standards:.
  • IEC 61000-4-2.
  • 15 kV (air discharge).
  • 8 k.

📥 Download Datasheet

Datasheet preview – ESDA14V2-4BF3

Datasheet Details

Part number ESDA14V2-4BF3
Manufacturer STMicroelectronics
File Size 182.69 KB
Description Quad bidirectional TRANSIL array
Datasheet download datasheet ESDA14V2-4BF3 Datasheet
Additional preview pages of the ESDA14V2-4BF3 datasheet.

📁 Similar Datasheet

  • ESDA14V2-4BF1 - QUAD BIDIRECTIONAL TRANSIL-TM ARRAY (STMicroelectronics)
  • ESDA14V2-4BF2 - QUAD BIDIRECTIONAL TRANSIL-TM ARRAY (STMicroelectronics)
  • ESDA14V2 - QUAD TRANSIL ARRAY FOR ESD PROTECTION (STMicroelectronics)
  • ESDA14V2 - DUAL TRANSIL ARRAY FOR ESD PROTECTION (STMicroelectronics)
  • ESDA14V2BP6 - ESD protection (STMicroelectronics)
  • ESDA14V2L - DUAL TRANSIL ARRAY (STMicroelectronics)
  • ESDA14V2L - ESD Protection Diodes (Kexin)
  • ESDA14V2LY - Automotive dual Transil array (STMicroelectronics)
  • ESDA14V2SC5 - QUAD TRANSIL ARRAY (STMicroelectronics)
  • ESDA14V2SC6 - QUAD TRANSIL ARRAY (STMicroelectronics)
Other Datasheets by ST Microelectronics

Full PDF Text Transcription

Click to expand full text
www.DataSheet4U.com ESDA14V2-4BF3 Quad bidirectional Transil™ array for ESD protection Features ■ ■ ■ ■ ■ 4 Bidirectional Transil functions ESD Protection: IEC61000-4-2 level 4 Stand off voltage: 12 V Min. Low leakage current < 0.5 µA 50 W Peak pulse power (8/20 µs) Flip Chip (5 bumps) Benefits ■ ■ ■ High ESD protection level High integrationSuitable for high density boards Suitable for high density boards Figure 1. Pin layout (bump side) 3 2 1 A B C Complies with the following standards: ■ IEC 61000-4-2 – 15 kV (air discharge) – 8 kV (contact discharge) MIL STD 883E- Method 3015-7: class3 ■ – 25 kV (human body model) Figure 2.
Published: |