CONNECTION DIAGRAM AND MECHANICAL DATA
4 10.16 (0.40)
1 = + Vin
2 = - Vin
3 = Case
4 = - Vout
5 = + Vout
Package G. Dimensions in mm (inches)
Worst case power dissipation at full load is less than
To operate the device at an ambient temperature of
60 °C the thermal resistance case-to-ambient must
be lower than 6.5 °C/W.
This can be accomplished by adding an external
heatsink or by forced ventilation with air speed of
about 100 linear feet/minute.
The MTBF according to MIL HDBK-217E calcula-
tion for a ground benign environment is:
- 216k hours for a case temperature of 91 °C.
- 379k hours for a case temperature of 60 °C.
This last condition can be obtained at Tamb.= 40 °C
and forced ventilation of 100 feet/minute.
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specification mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectronics.
© 1994 SGS-THOMSON Microelectronics – All Rights Reserved
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