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STMicroelectronics Electronic Components Datasheet

LIS2DH Datasheet

MEMS digital output motion sensor

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LIS2DH
MEMS digital output motion sensor:
ultra low-power high performance 3-axis “femto” accelerometer
Features
Wide supply voltage, 1.71 V to 3.6 V
Independent IOs supply (1.8 V) and supply
voltage compatible
Ultra low-power mode consumption down to 2
µA
±2g/±4g/±8g/±16g dynamically selectable full-
scale
I2C/SPI digital output interface
2 independent programmable interrupt
generators for free-fall and motion detection
6D/4D orientation detection
“Sleep to wake” and “return to sleep” function
Freefall detection
Motion detection
Embedded temperature sensor
Embedded FIFO
ECOPACK® RoHS and “Green” compliant
Applications
Motion activated functions
Display orientation
Shake control
Pedometer
Gaming and virtual reality input devices
Impact recognition and logging
LGA-14 (2.0x2.0x1 mm)
Description
The LIS2DH is an ultra low-power high
performance three-axis linear accelerometer
belonging to the “femto” family, with digital I2C/SPI
serial interface standard output.
The LIS2DH has dynamically user selectable full
scales of ±2g/±4g/±8g/±16g and it is capable of
measuring accelerations with output data rates
from 1 Hz to 5.3 kHz.
The self-test capability allows the user to check
the functioning of the sensor in the final
application.
The device may be configured to generate
interrupt signals by two independent inertial
wake-up/free-fall events as well as by the position
of the device itself.
The LIS2DH is available in small thin plastic land
grid array package (LGA) and is guaranteed to
operate over an extended temperature range from
-40 °C to +85 °C.
Table 1. Device summary
Order codes
Temperature range [° C]
LIS2DH
-40 to +85
LIS2DHTR
-40 to +85
Package
LGA-14
LGA-14
Packaging
Tray
Tape and reel
November 2011
Doc ID 022516 Rev 1
1/49
www.st.com
49


STMicroelectronics Electronic Components Datasheet

LIS2DH Datasheet

MEMS digital output motion sensor

No Preview Available !

Contents
Contents
LIS2DH
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2 Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.4 Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.4.1
2.4.2
SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
I2C - inter IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.5 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.6 Terminology and functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.6.1 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.6.2 Zero-g level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.6.3 High resolution, normal mode, low power mode . . . . . . . . . . . . . . . . . . 14
2.6.4 Self-test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.6.5 6D / 4D orientation detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.6.6 “Sleep to wake” and “Return to sleep” . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.7 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.8 IC interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.9 Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.10 FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.11 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.1 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4 Digital main blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.1 FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.1.1 Bypass mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2/49 Doc ID 022516 Rev 1


Part Number LIS2DH
Description MEMS digital output motion sensor
Maker STMicroelectronics
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LIS2DH Datasheet PDF






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