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LIS2DH12 Datasheet

MEMS digital output motion sensor

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LIS2DH12
MEMS digital output motion sensor:
ultra-low-power high-performance 3-axis "femto" accelerometer
Datasheet - production data
/*$ [[PP 
Features
Wide supply voltage, 1.71 V to 3.6 V
Independent IO supply (1.8 V) and supply
voltage compatible
Ultra-low power consumption down to 2 μA
 2g/±4g/8g/16g selectable full scales
I2C/SPI digital output interface
2 independent programmable interrupt
generators for free-fall and motion detection
6D/4D orientation detection
“Sleep-to-wake” and “return-to-sleep” functions
Free-fall detection
Motion detection
Embedded temperature sensor
Embedded FIFO
ECOPACK®, RoHS and “Green” compliant
Description
The LIS2DH12 is an ultra-low-power high-
performance three-axis linear accelerometer
belonging to the “femto” family with digital I2C/SPI
serial interface standard output.
The LIS2DH12 has user-selectable full scales of
2g/±4g/8g/16g and is capable of measuring
accelerations with output data rates from 1 Hz to
5.3 kHz.
The self-test capability allows the user to check
the functionality of the sensor in the final
application.
The device may be configured to generate
interrupt signals by detecting two independent
inertial wake-up/free-fall events as well as by the
position of the device itself.
The LIS2DH12 is available in a small thin plastic
land grid array package (LGA) and is guaranteed
to operate over an extended temperature range
from -40 °C to +85 °C.
Table 1. Device summary
Order code
Temp.
range [C]
Package Packaging
LIS2DH12TR -40 to +85
LGA-12
Tape and
reel
Applications
Motion-activated functions
Display orientation
Shake control
Pedometer
Gaming and virtual reality input devices
Impact recognition and logging
May 2017
This is information on a product in full production.
DocID025056 Rev 6
1/53
www.st.com


STMicroelectronics Electronic Components Datasheet

LIS2DH12 Datasheet

MEMS digital output motion sensor

No Preview Available !

Contents
Contents
LIS2DH12
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2 Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . 10
2.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.2 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.4 Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.4.1
2.4.2
SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
I2C - inter-IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.5 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3 Terminology and functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1.1 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1.2 Zero-g level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.2 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.2.1 High-resolution, normal mode, low-power mode . . . . . . . . . . . . . . . . . . 16
3.2.2 Self-test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.2.3 6D / 4D orientation detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.2.4 “Sleep-to-wake” and “Return-to-sleep” . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.3 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.4 IC interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.5 Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.6 FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.7 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5 Digital main blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.1 FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2/53 DocID025056 Rev 6


Part Number LIS2DH12
Description MEMS digital output motion sensor
Maker STMicroelectronics
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