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STMicroelectronics Electronic Components Datasheet

LPS331AP Datasheet

MEMS pressure sensor

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LPS331AP
MEMS pressure sensor: 260-1260 mbar absolute digital output
barometer
Datasheet production data
Features
260 to 1260 mbar absolute pressure range
High-resolution mode: 0.020 mbar RMS
Low power consumption:
– Low resolution mode: 5.5 µA
– High resolution mode: 30 µA
High overpressure capability: 20x full scale
Embedded temperature compensation
Embedded 24-bit ADC
Selectable ODR from 1 Hz to 25 Hz
SPI and I2C interfaces
Supply voltage: 1.71 to 3.6 V
High shock survivability: 10,000 g
Small and thin package
ECOPACK® lead-free compliant
Applications
Indoor and outdoor navigation
Enhanced GPS for dead-reckoning
Altimeter and barometer for portable devices
Weather station equipment
Sport watches
Description
The LPS331AP is an ultra compact absolute
piezoresistive pressure sensor. It includes a
monolithic sensing element and an IC interface
able to take the information from the sensing
element and to provide a digital signal to the
external world.
Table 1. Device summary
Order codes
Temperature range [°C]
LPS331APY
LPS331APTR
-40 to +85
HCLGA-16L
(3 x 3 x 1 mm)
The sensing element consists of a suspended
membrane realized inside a single mono-silicon
substrate. It is capable to detecting pressure and
is manufactured using a dedicated process
developed by ST, called VENSENS.
The VENSENS process allows to build a mono-
silicon membrane above an air cavity with
controlled gap and defined pressure. The
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membrane is very small compared to the
traditionally built silicon micromachined
membranes. Membrane breakage is prevented by
an intrinsic mechanical stopper.
The IC interface is manufactured using a standard
CMOS process that allows a high level of
integration to design a dedicated circuit which is
trimmed to better match the sensing element
characteristics.
The LPS331AP is available in a small holed cap
land grid array (HCLGA) package and it is
guaranteed to operate over a temperature range
extending from -40 °C to +85 °C. The package is
holed to allow external pressure to reach the
sensing element.
Package
HCLGA-16L
Packing
Tray
Tape and reel
March 2012
This is information on a product in full production.
Doc ID 022112 Rev 7
1/36
www.st.com
36
Datasheet pdf - http://www.DataSheet4U.co.kr/


STMicroelectronics Electronic Components Datasheet

LPS331AP Datasheet

MEMS pressure sensor

No Preview Available !

Contents
Contents
LPS331AP
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 LPS331AP block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.2 IC interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.3 Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.1 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
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5 Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.1 I2C serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.2 I2C serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.2.1 I2C operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3 SPI bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.3.1 SPI read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.3.2 SPI write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.3.3 SPI read in 3-wires mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6 Register mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
8 Package mechanical section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
2/36 Doc ID 022112 Rev 7
Datasheet pdf - http://www.DataSheet4U.co.kr/


Part Number LPS331AP
Description MEMS pressure sensor
Maker STMicroelectronics
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LPS331AP Datasheet PDF






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