SUMMARY MULTI-CHIP PACKAGE
  – 1 die of 256 Mbit (16Mb x16, Multiple Bank, Multi-level, Burst) Flash Memory
  – 1 die of 64 Mbit (4Mb x16) Pse.

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Flash Memory Component . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PSRAM Component. . . . . . . . .

M36L0R8060

M36L0R8060T1

M36L0R7040B0

M36L0R7040T0

M36L0R7050

M36L0R7050B0

M36L0R7050L1

M36L0R7050T0

M36L0R7050U1

M36L0R7060B1

M36L0R7060L1

M36L0R7060T1

M36L0R7060U1