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MP23ABS1 - MEMS audio sensor

General Description

The MP23ABS1 is a compact, low-power microphone built with a capacitive sensing element and an IC interface.

The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors.

Key Features

  • Single supply voltage operation 1.52 V - 3.6 V.
  • Omnidirectional sensitivity.
  • High signal-to-noise ratio.
  • High acoustic overload point: 130 dBSPL typ.
  • Package compliant with reflow soldering.
  • Enhanced RF immunity.
  • Ultra-flat frequency response.
  • Low latency.
  • Ultra-low-power: 150 μA max.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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MP23ABS1 High-performance MEMS audio sensor: single-ended analog bottom-port microphone Datasheet - production data RHLGA metal cap 5-lead 3.5 x 2.65 x 0.98 mm Features  Single supply voltage operation 1.52 V - 3.6 V  Omnidirectional sensitivity  High signal-to-noise ratio  High acoustic overload point: 130 dBSPL typ.  Package compliant with reflow soldering  Enhanced RF immunity  Ultra-flat frequency response  Low latency  Ultra-low-power: 150 μA max  ECOPACK®, RoHS, and “Green” compliant Description The MP23ABS1 is a compact, low-power microphone built with a capacitive sensing element and an IC interface. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors.