Part number:
SDIP30
Manufacturer:
File Size:
53.16 KB
Description:
Sdip30 thermal data.
Thermal Data www.DataSheet4U.com SDIP 30 30 leads PACKAGE MATERIAL LIST item # leadframe die attach molding compound material copper epoxy glu.
SDIP30
53.16 KB
Sdip30 thermal data.
Thermal Data www.DataSheet4U.com SDIP 30 30 leads PACKAGE MATERIAL LIST item # leadframe die attach molding compound material copper epoxy glu.
📁 Related Datasheet
SDI-001 SERIAL D1 TO RGB/YPBPR AND CVBS MODULE (Faraday Technology)
SDI-002 SERIAL D1 TO RGB MODULE (Faraday Technology)
SDI-003 SERIAL D1 TO CVBS/YC MODULE (Faraday Technology)
SDI-321618 SMD Miniature Inductors (Chilisin)
SDI-322520 SMD Miniature Inductors (Chilisin)
SDI-453226 SMD Miniature Inductors (Chilisin)
SDI-C403 Bi-CMOS IC (Ever)
SDI100N12 NPT IGBT Modules (Sirectifier Semiconductors)
SDI100S12 SPT IGBT Modules (Sirectifier Semiconductors)
SDI145S12 SPT IGBT Modules (Sirectifier Semiconductors)
