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SDIP30 SDIP30 Thermal Data

STMicroelectronics

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Description

 Thermal Data www.DataSheet4U.com SDIP 30 30 leads PACKAGE MATERIAL LIST item # leadframe die attach molding compound material copper epoxy glu.

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Datasheet Specifications

Part number: SDIP30
Manufacturer: STMicroelectronics ↗
File Size: 53.16 KB
Datasheet: SDIP30_STMicroelectronics.pdf
Description: SDIP30 Thermal Data

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SDIP30 SDIP30 Thermal Data STMicroelectronics

STMicroelectronics SDIP30-like datasheet