ST6G3244ME Datasheet Text
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ST6G3244ME
Level translator for SD, SDIO, mini SD, and micro SD Cards with internal I/O supply and ±15 kV ESD protection
Features
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- Supports 60 MHz clock rate Supports DDR mode for SD Card™ pliant with
- SD Specification Part 1 Physical Layer Specification 3.00 (SDR12, SDR25, DDR50)
- SD Specification Part 1 Physical Layer Specification 2.00 Bi-directional with direction control pin Balanced propagation delays: tPLH ≈ tPHL LDO power-down support. When the LDO is powered down, VCCB is pulled to GND via the 130 Ω resistor. When VCCB = 0 V, there is no additional leakage seen on VCCA. EMI filtering and signal conditioning Supports both 1.8 V and 2.9 V data translation on card side Integrated LDO to supply 1.8 V or 2.9 V power for B-side I/Os (pin-selectable); can be used also externally Integrated pull-up and pull-down resistors on B-side Operating voltage range
- VCCA = 1.62 V to 1.98 V
- VBAT = 3.0 V to 5.0 V Latch-up performance exceeds 100 mA (JEDEC Standard 78) ESD protection for card side (B-port, CD and WP pins)
- ±8 kV contact discharge (IEC61000-4-2)
- ±15 kV air-gap discharge (IEC61000-4-2) ESD protection for host side (A-side)
- ±2 kV HBM (JEDEC 22-A114)
- ±200 V MM (JEDEC 22-A115)
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- Flip Chip 25
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- Operating temperature range
- 40 °C to +85 °C Space-saving Flip Chip 25 package (2 x 2 x 0.605 mm, 0.4 mm bump pitch) RoHS pliant, lead-free soldering capable
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- Applications
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- Mobile phones, smartphones PDAs Cameras SD Card readers Any device with SD memory card Device summary
Package Packing Package topmark
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Table 1.
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Order code
Tape Flip Chip 25 and reel 2x2x (5000 ST6G3244MEBJR 0.605 mm, parts per 0.4 mm reel) bump pitch...