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TN1258 Technical note
An innovative high power IC surface mount package family: PowerSO-20 & PowerSO-36 Power IC packaging from insertion to surface mounting
Introduction
An innovative, high power IC surface mount package family is introduced in this note. It is called PowerSO family and has the Jedec registration MO-166. STMicroelectronics developed PowerSO in order to answer the increasing demand of miniaturization and quality in power applications. Automotive, industrial, audio and telecom markets will take advantage of the new package, by introducing the use of Surface Mount Technology in the production of power systems. PowerSO-20 and PowerSO-36 are the elements of the MO-166 family having 20 leads at 0.050 inch pitch (1.27 mm) and 36 leads at 0.026 inch pitch (0.65 mm) respectively.
TN1258 Datasheet
