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STMicroelectronics Electronic Components Datasheet

TN1258 Datasheet

An innovative high power-IC

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TN1258
Technical note
An innovative high power IC surface mount package family: PowerSO-20
& PowerSO-36 Power IC packaging from insertion to surface mounting
Introduction
An innovative, high power IC surface mount package family is introduced in this note. It is called
PowerSO family and has the Jedec registration MO-166.
STMicroelectronics developed PowerSO in order to answer the increasing demand of miniaturization
and quality in power applications. Automotive, industrial, audio and telecom markets will take advantage
of the new package, by introducing the use of Surface Mount Technology in the production of power
systems.
PowerSO-20 and PowerSO-36 are the elements of the MO-166 family having 20 leads at 0.050 inch
pitch (1.27 mm) and 36 leads at 0.026 inch pitch (0.65 mm) respectively. These packages are in mass
production since 1995.
This note is intended to compare the PowerSO-20/36 with alternative surface mount solutions and to the
existing Multiwatt package, the well known "double TO-220" developed by STMicroelectronics in late
70s.
Data presented here demonstrates that PowerSO-20 is the real successor of Multiwatt for surface
mount applications and becomes a milestone in power package technology with PowerSO-36 as
Multiwatt did 30 years ago.
Figure 1: PowerSO-20 Jedec registration MO-166
November 2017
DocID031323 Rev 1
GADG0711171203PS
1/33
www.st.com


STMicroelectronics Electronic Components Datasheet

TN1258 Datasheet

An innovative high power-IC

No Preview Available !

Contents
Contents
TN1258
1 Power devices and surface mounting............................................ 5
1.1 Intermediate solutions: insertion packages converted to SMT .......... 5
1.2 New solutions: original STMicroelectronics packages with design-in
SMT characteristics........................................................................................ 6
2 Structure and characteristics of PowerSO-20/36 ........................ 11
2.1 High power structure and process (>20 W)..................................... 11
2.2 High current capability (10-20 A)..................................................... 11
2.3 Miniaturization ................................................................................. 12
2.4 Designed-in surface mount characteristics ..................................... 12
2.5 Hermeticity ...................................................................................... 15
3 Thermal design and applications ................................................. 16
3.1 Junction-to-case thermal resistance................................................ 16
3.2 Applications with 1-2 Watt dissipation ............................................. 17
3.2.1 On board dissipating elements ......................................................... 17
3.3 Applications with 2-5 W dissipation ................................................. 19
3.3.1 Dissipating elements and ground layer ............................................ 19
3.3.2 Via holes and ground layer............................................................... 19
3.3.3 Via holes and external heatsink ....................................................... 21
3.4 High power applications (up to 20 W) with standard substrate ....... 21
3.4.1 Slug-up package and external heatsink ........................................... 22
3.4.2 Cavity board and external heatsink .................................................. 24
3.5 High power applications (up to 20 W) with Insulated Metal
Substrates (IMS) .......................................................................................... 24
3.6 High power pulses and thermal impedance .................................... 25
4 Soldering information ................................................................... 28
5 Reliability data ............................................................................... 29
6 Conclusion..................................................................................... 31
7 Revision history ............................................................................ 32
2/33
DocID031323 Rev 1


Part Number TN1258
Description An innovative high power-IC
Maker STMicroelectronics
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