900,000+ datasheet pdf search and download

Datasheet4U offers most rated semiconductors data sheet pdf




  Samsung Electronic Components Datasheet  

CIM05U241 Datasheet

Chip Bead

No Preview Available !

Chip Bead ; CIB/CIM Series
For EMI Suppression
Feature
Smallest beads suitable for surface mounting
Perfect shape for automatic mounting, with no directionality.
Excellent solderability and high heat resistance for either flow or
reflow soldering.
Monolithic inorganic material construction for high reliability.
Closed magnetic circuit configuration avoids crosstalk and is suitable
for high density PCBs.
Application
High frequency EMI prevention application to computers, printers,
VCRs, TVs and mobile phones.
The CIB/CIM Series are used for EMI suppression filter. These beads suppress electro-magnetic wave noise by
increased impedance, especially by increased resistance at noise frequency.
CIB Series
The CIB Series is composed of mono-layer internal conductor that allows low impedance and low DC resistance.
CIM Series
The CIM Series display high impedance because it is composed of a multilayered internal conductor and has excellent
attenuation characteristics for wide band frequencies.
Operating Temp
Storage Temp
-55~+125
-10~+40
Dimensions
Ferrite Body
External Electrode
d
t
W
L
SIZE CODE
03
05
10
21
31
32
41
43
L
0.6 0.03
1.0 0.05
1.6 0.15
2.0 0.2
3.2 0.2
3.2 0.2
4.5 0.2
4.5 0.2
W
0.3 0.03
0.5 0.05
0.8 0.15
1.25 0.2
1.6 0.2
2.5 0.2
1.6 0.2
3.2 0.2
t
0.3 0.03
0.5 0.05
0.8 0.15
0.9 0.2
1.1 0.2
1.3 0.2
1.6 0.2 / 1.2 0.2
1.5 0.2
Part Numbering
CI M
03
J 121 N
C
(1) (2) (3) (4) (5) (6) (7)
(1) Chip Beads
(2) B:Mono-layer type, M:Multi-layer type
(3) Dimension
(4) Material Code
P,U:Broad impedance, especially suppresses noise in the 10~200MHz range
J :Suppresses noise in the 100~300MHz range
K :Suppresses noise in the 200MHz above
N :Suppresses noise in the 200~500MHz range
(5) Nominal impedance (110:11 ; 121:120 )
(6) Thickness option(N:Standard , A:Thinner than standard , B:Thicker than standard)
(7) Packaging(C:paper tape, E:embossed tape)
Unit: mm
d
0.15 0.05
0.25 0.1
0.3 0.2
0.5 0.2,-0.3
0.5 0.2,-0.3
0.5 0.3
0.5 0.3
0.5 0.3


  Samsung Electronic Components Datasheet  

CIM05U241 Datasheet

Chip Bead

No Preview Available !

CIM 0603(0201) Type
Part No.
CIM 03N 300
CIM 03N 800
CIM 03U 800
CIM 03U 121
CIM 03U 241
CIM 03J 121
CIM 03J 241
Thickness
(mm)
0.3 0.03
0.3 0.03
0.3 0.03
0.3 0.03
0.3 0.03
0.3 0.03
0.3 0.03
Impedance
( ) 25%
100 MHz
30
80
80
120
240
120
240
DC Resistance
( ) Max.
0.8
1.2
0.5
0.8
1.0
0.8
1.0
Rated Current
(mA) Max.
150
100
200
200
100
200
100
Electrical Characteristics
300
200
100
0
1M
200
100
0
1M
400
CIM03N300
Z
R
10M 100M
FREQUENCY(Hz)
CIM03U800
X
1G
800
600
400
200
0
1M
300
Z
R
X
10M 100M
FREQUENCY(Hz)
CIM03J121
200
100
0
1G 1M
600
CIM03N800
ZR
10M 100M
FREQUENCY(Hz)
CIM03U121
X
1G
Z
400
R 200
X
10M 100M
FREQUENCY(Hz)
CIM03J241
0
1G 1M
CIM03U241
Z
R
X
10M 100M
FREQUENCY(Hz)
200
0
1M
Z
R
X
10M 100M
FREQUENCY(Hz)
1G
400
200
0
1M
Z
R
X
10M 100M
FREQUENCY(Hz)
1G
1G
6
7


Part Number CIM05U241
Description Chip Bead
Maker Samsung
Total Page 16 Pages
PDF Download

CIM05U241 Datasheet PDF

View PDF for Mobile








Similar Datasheet

1 CIM05U241 Chip Bead
Samsung
2 CIM05U241 Chip Bead
Samsung





Part Number Start With

0    1    2    3    4    5    6    7    8    9    A    B    C    D    E    F    G    H    I    J    K    L    M    N    O    P    Q    R    S    T    U    V    W    X    Y    Z

Site map

Webmaste! click here

Contact us

Buy Components

Privacy Policy