512mb j-die ddr sdram.
4 2. Ordering Information ......... 4 3. Operating Frequencies ..... 4 4. Pin / Ball Description ......... 5 4.1 Pin Description .. 5 4.2 Package Physical Dimension (TSO.
where product failure could result in loss of life or personal or physical harm, or any military or defense application,.
......... 5 4.1 Pin Description .. 5 4.2 Package Physical Dimension (TSOP II) .... 6 4.3 Ball Description.. 7 4.4 Package Physical Dimension (FBGA) ....... 8 5. Block Diagram (32Mb x4 / 16Mb x8 / 8Mb x 16 I/O x4 Banks) ..... 9 6. Input/Output Functio.
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