Description
32Mb x 16 64Mb x 8 128Mb x 4
DDR SDRAM
VDD DQ0 VDDQ DQ1 DQ2 VSSQ DQ3 DQ4 VDDQ DQ5 DQ6 VSSQ DQ7 NC VDDQ LDQS NC VDD NC LDM WE CAS RAS
CS NC BA0 BA1 AP/A10 A0 A1 A2 A3 VDD
VDD DQ0 VDDQ NC DQ1 VSSQ NC DQ2 VDDQ NC DQ3 VSSQ NC NC VDDQ NC NC VDD NC NC WE CAS RAS
CS NC BA0 BA1 AP/A10 A0 A1 A2 A3 VDD
VDD NC VDDQ NC DQ0 VSSQ NC NC VDDQ NC DQ1 VSSQ NC NC VDDQ NC NC VDD NC NC WE CAS RAS CS NC BA0 BA1 AP/A10 A0 A1 A2 A3 VDD
1 66
2 65
3 64
4 63
5 62
6 61
7 60
8 59
9 58
10 66Pin TSOPII 57 11 (4
Features
- VDD : 2.5V ± 0.2V, VDDQ : 2.5V ± 0.2V for DDR266, 333.
- VDD : 2.6V ± 0.1V, VDDQ : 2.6V ± 0.1V for DDR400.
- Double-data-rate architecture; two data transfers per clock cycle.
- Bidirectional data strobe [DQS] (x4,x8) & [L(U)DQS] (x16).
- Four banks operation.
- Differential clock inputs(CK and CK).
- DLL aligns DQ and DQS transition with CK transition.
- MRS cycle with address key programs
-. Read latency : DDR266(2, 2.5 Clock), DDR333(.