K4W2G1646C Key Features
- 7 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package
- 7 3.2 FBGA Package Dimension (x16)
- Part: K4W2G1646C
- Manufacturer: Samsung Semiconductor
- Size: 2.63 MB
Related Samsung Semiconductor Datasheets
| Part Number | Description |
|---|---|
| K4W1G1646E | 1Gb gDDR3 SDRAM E-die |
K4W2G1646C Description
.............................................................................................................................. gDDR3 SDRAM Addressing ...............................................................................................