KLM4G1FETE-B041 Samsung

..... 4 3.0 PACKAGE CONFIGURATIONS ... 5 3.1 153 Ball Pin Configuration .. 5 3.1.1 11mm x 10mm x 0.8mm Package Dimension 6 3.2 Product Architecture .... 7 4.0 HS400 mode.

where product failure could result in loss of life or personal or physical harm, or any military or defense application,.