KMK2U000VM-B604 Description
is referenced by JEDEC Standard SAMSUNG e·MMC supports below special.
KMK2U000VM-B604 Key Features
- Operating Temperature : -25C ~ 85C
- Package :186-ball FBGA Type
- 12 x 16 x 1.4mmt, 0.5mm pitch <e-MMC> - MultiMediaCard System Specification Ver. 4.41 patible. Detail description is re
- High Priority Interrupt scheme is supported
- Back ground operation is supported
- Full backward patibility with previous MultiMediaCard system ( 1bit data bus, multi-e-MMC systems)
- Data bus width : 1bit (Default) , 4bit and 8bit
- MMC I/F Clock Frequency : 0 ~ 52MHz MMC I/F Boot Frequency : 0 ~ 52MHz
- Power : Interface power → VDD = VCCQm(1.70V ~ 1.95V or 2.7V ~ 3.6V) , Memory power → VDDF = VCCm(2.7V ~ 3.6V) <LPDDR2>
- Double-data rate architecture; two data transfers per clock cycle