4 3. Address Configuration ...... 4 4. x64 DIMM Pin Configurations (Front side/Back side) ......... 5 5. x72 DIMM Pin Configurations (Front side/Back side) ......... 6 6.

where product failure could result in loss of life or personal or physical harm, or any military or defense application,.

....... 7 7. SPD and Thermal Sensor for ECC UDIMMs .. 7 8. Input/Output Functional Description...... 8 8.1 Address Mirroring Feature ..... 9 8.1.1. DRAM Pin Wiring Mirroring ...... 9 9. Function Block Diagram: ... 10 9.1 8GB, 1Gx64 Non ECC Module (Po.

M378B1G73BH0

M378B1G73QH0

M378B2873DZ1

M378B2873FH0

M378B5173BH0

M378B5173QH0

M378B5273BH1

M378B5273CH0

M378B5273DH0

M378B5673DZ1

M378B5673FH0

M378B5773CH0

M378B5773DH0

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