K4B1G0846C, K4B1G0446C Datasheet - Samsung semiconductor

K4B1G0846C 1Gb C-die DDR3 SDRAM

11 5.0 DDR3 SDRAM Addressing 12 6.0 Absolute Maximum Ratings 14 6.1 Absolute Maximum DC Ratings 14 6.2 DRAM Component Operating Temperature Range 14 7.0 AC & DC Operating Conditions 14 7.1 Recommended DC operating Conditions (SSTL_1.5) 14 8.0 AC & DC Input Measurement Levels 15 8.1 AC and DC Logic i.

K4B1G04(08/16)46C 1Gb DDR3 SDRAM www.DataSheet4U.com 1Gb C-die DDR3 SDRAM Specification Revision 1.0 June 2007 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE O.

K4B1G0846C Features

* 4 3.0 Package pinout/Mechanical Dimension & Addressing 5 3.1 x4 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) 5 3.2 x8 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) 6 3.3 x16 Package Pinout (Top view) : 112ball FBGA Packag

K4B1G0446C_Samsungsemiconductor.pdf