* 4 3.0 Package pinout/Mechanical Dimension & Addressing 5 3.1 x4 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) 5 3.2 x8 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) 6 3.3 x16 Package Pinout (Top view) : 112ball FBGA Packag
K4B1G0846C Datasheet (1.30 MB)
K4B1G0846C
Samsung semiconductor
1.30 MB
1gb c-die ddr3 sdram.
K4B1G04(08/16)46C 1Gb DDR3 SDRAM www.DataSheet4U.com 1Gb C-die DDR3 SDRAM Specification Revision 1.0 June 2007 INFORMATION IN THIS DOCUMENT IS PRO.
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