MR18R326GAG0 Description
MR18R326GAG0 Change History Version 1.0 (Mar. (July 2002) 256/288Mbit D-die RIMM Module Datasheet Page 0 Version 1.0 Mar. The RIMM module consists of 576Mb RDRAM devices.
MR18R326GAG0 Key Features
- High speed up to 1066 MHz RDRAM storage
- 184 edge connector pads with 1mm pad spacing
- Module PCB size : 133.35mm x 34.93mm x 1.27mm
- Each RDRAM device has 32 banks, for a total of 512
- Gold plated edge connector pad contacts
- Serial Presence Detect(SPD) support
- Operates from a 2.5 volt supply (±5%)
- Powerdown self refresh modes
- Separate Row and Column buses for higher efficiency
- WBGA lead free package (92 balls)