STK4067 Key Features
- Superior heat sink capacity using IMST (insulated metal substrate technology)
- Supports sufficient amplifier configurations for high power output
- Low-load impedance driver Supports independent or parallel speaker connections for low-load impedance driving
- High temperature operation Provides guaranteed high output to the passenger partments protected interior even when opera
- pact heat sink mounting Supports pact total-set packaging, occupying 1/3 the heat sink area pared of monolithic ICs, and