Glass Passivated Chip Low Leakage Built-in Strain Relief Low Inductance High Peak Reverse Power Dissipation For Use in Stabilizing and Clipping Circuits with High Power R.

3EZ33D10

3EZ33D5L

3EZ33

3EZ330D5

3EZ330D5L

3EZ3.3D5

3EZ3.6D5

3EZ3.9D10

3EZ3.9D5

3EZ3.9D5L

3EZ30

3EZ300D5

3EZ300D5L

Since 2006. D4U Semicon.   |   Contact Us   |   Privacy Policy   |   Purchase of parts