Glass Passivated Chip Low Leakage Built-in Strain Relief Low Inductance High Peak Reverse Power Dissipation For Use in Stabilizing and Clipping Circuits with High Power R.

3EZ47D10

3EZ47D5L

3EZ47

3EZ4.3D10

3EZ4.3D5

3EZ4.3D5L

3EZ4.7D10

3EZ4.7D5

3EZ4.7D5L

3EZ400D5

3EZ400D5L

3EZ43

3EZ43D10

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