QG206AM Datasheet (PDF) Download
SeCoS Halbleitertechnologie GmbH
QG206AM

Key Features

  • Low profile package
  • Glass Passivated Chip Juntion
  • Low reverse current
  • Lead free in ply with EU RoHS 2011/65/EU directives
  • Terminals: Solderable per MIL-STD-750, Method 2026
  • Weight: 27 mgram (Approximate)