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SMD03C Datasheet Preview

SMD03C Datasheet

TVS DIODE

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Elektronische Bauelemente
SMD03C THRU SMD36C
300W TVS DIODE ARRAY
RoHS Compliant Product
A suffix of "-C" specifies halogen & lead-free
FEATURES
SC59 package for surface mount appllcation
Protects 3.3V up through 36V components
Protects two unidirectional line or one bidirection line
Provides electrically is olated protection
ESD>10KV
300W Peak Power Protection( tp=8/2 us)
A
L
3
Top View
1
2
BS
MECHANICAL DATA
Molded: SC59 Surface Mount
Body marked with marking code.
Mounting Position: Any
Weight: 0.008 grams (approx.)
V
G
C
D
H
K
APPLICATIONS
Cellular Handsets and Accessories
Portable Electronics
Industrial Controls
Set -Top Box
Servers, Notebook, and Desktop PC
3
3
1
2
J
1
2
SC-59(SOT-23)
Dim Min Max
A 2.700 3.100
B 1.200 1.400
C 0.900 1.150
D 0.350 0.500
G 1.700 2.100
H 0.013 0.100
J 0.085 0.200
K 0.450 0.600
L 0.900 1.000
S 2.200 2.600
V 0.450 0.600
All Dimension in mm
MAXIMUM RATING SAND ELECTRICAL CHARACTERISTICS
Rating
Peak Pulse Power (tp=8/20us)
Thermal Resistance, Junction to Ambient
Lead Soldering Temperature
Operating Temperature
Storage Temperature
Symbol
Ppk
0JA
TL
TJ
TSTG
Value
300
556
260 (10 sec.)
-55 to +125
-55 to +150
Units
Watts
/W
ELECTRICAL CHARACTERISTICS PER LINE @ 25º C Unless otherwise specified
PART
NUMBER
DEVICE
MARKING
STAND
OFF
VOLTAGE
VWM
VOLTS
BREAKDOWN
VOLTAGE
VBR
@1 mA
VOLTS
CLAMPING
VOLTAGE
VC
@ 1 Amp
(FIGURE 2)
VOLTS
CLAMPING
VOLTAGE
VC
@ 5 Amp
(FIGURE 2)
VOLTS
LEAKAGE
CURRENT
ID
@ VWM
µA
CAPACITANCE
@0V, 1 MHz
C
Pin 1-3 or 2-3
pF
CAPACITANCE
@0V, 1 MHz
C
Pin 1-2
pF
MIN
MAX
MAX
MAX
MAX
MAX
SMD03C
M03
3.3
4
7
8.5
100
700
350
SMD05C
M05
5.0
6.1
9.8
11
12
420
210
SMD12C
M12
12.0
13.3
19
24
0.5
150
75
SMD15C
M15
15.0
16.7
24
30
0.5
100
50
SMD24C
M24
24.0
26.7
43
55
0.5
60
30
SMD36C
M36
36.0
40.0
60
75
0.5
60
30
NOTE: Transient Voltage Suppression (TVS) product is normally selected based on its stand off Voltage VWM. Product
selected voltage should be equal to or greater than the continuous peak operating voltage of the circuit to be protected.
http://www.SeCoSGmbH.com
1-Feb-2007 Rev. D
Any changing of specification will not be informed individual
Page 1 of 2




SeCoS

SMD03C Datasheet Preview

SMD03C Datasheet

TVS DIODE

No Preview Available !

Elektronische Bauelemente
SMD03C THRU SMD36C
300W TVS DIODE ARRAY
Non-Repetitive Peak Pulse Power vs. Pulse Time
10
1
0. 1
0. 01
0.1
1
10
100
1000
P ulse Duration - tp (u s)
110
100
90
80
70
60
50
40
30
20
10
0
0
Pulse Waveform
e-t
td = I PP /2
Wave form
Paramete rs:
tr = 8 s
td = 20 s
5
10
15
20
25
30
Time (us)
Part Number
SMD05C
SMD12C
SMD15C
SMD24C
SMD36C
Marking Code
M05
M12
M15
M24
M36
Suggested Solder Pad Layout
0.9
1.4
4.0
1.2
1.4
2.6
mm
0.9
0.95
http://www.SeCoSGmbH.com
1-Feb-2007 Rev. D
11 0
10 0
90
80
70
60
50
40
30
20
10
0
0
Power Derating Curve
25
50
75
100
125
150
Ambient Temperature - TA (oC)
Applications Information
Device Connection Options
The SM series is designed to protect one bidirectional
or two unidirectional data or l/O lines operating at 5 to
36 volts.Connection options are as follows:
Bidirectional:Pin 1 is connected to the data line
and pin 2 is connected to ground (Since the device
lls symmetrical,these conmtions may be re-
Ver3ed).For best results,the ground connection
should be made directly to a ground plane on the
board.The path length should be kept as short as
possible to minimize parasitic inductance-Pin 3 is
not connected.
Unidirectional:Data lines are connected to pin1
and pin2.Pin 3 is connected to ground.For best
results,this pin should be connected directly to a
ground plane on the board.The path lengh should
be kept as short as possible to minimize parasitic
inductance.
Circuit Board Layout Recommendations for suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of fast rise-time transients such as ESD.The following
guidelines are recommended (Refer to application note
Sl99.01 for more detailed information):
Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path toground should be
kept as short as possible.
Never run critical signals near board edges
Use ground planes whenever possib|e.
Any changing of specification will not be informed individual
Page 2 of 2



Part Number SMD03C
Description TVS DIODE
Maker SeCoS
Total Page 2 Pages
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SMD03C Datasheet PDF





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